Semiconductor device and method for producing same

A semiconductor device having a substrate, a semiconductor element disposed on the substrate, a wire that electrically connects the substrate and the semiconductor element, a first sealing layer that seals the space below the apex of the wire, and a second sealing layer that is provided on top of th...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEMORI, Daichi, YAMADA, Kazuhiko, TOGAWA, Mitsuo, SATOH, Eiichi, SATO, Mizuko, SEKI, Kohei
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	A semiconductor device having a substrate, a semiconductor element disposed on the substrate, a wire that electrically connects the substrate and the semiconductor element, a first sealing layer that seals the space below the apex of the wire, and a second sealing layer that is provided on top of the first sealing layer with the bonding wire interposed therebetween, wherein the first sealing layer is formed from a cured film of a liquid sealing material, and the second sealing layer is formed from a dried coating film of an insulating resin coating material.