SOLDER PASTE

FIELD: printing industry.SUBSTANCE: solder paste contains, wt %: low-temperature solder powder 80...91 and the flux-bundle 9...20. The flux-bundle includes components in the following ratio, wt %: synthetic resin 30...60, a mixture of high boiling and low boiling organic solvents in the form of ethe...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ivanov Nikolaj Nikolaevich, Ivin Vladimir Dmitrievich, Gryaznov Sergej Yurevich
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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