SERVER FRAME WITH IMMERSION COOLING SYSTEM

FIELD: physics, computer engineering.SUBSTANCE: invention relates to the computer facilities. The server frame with immersion cooling system comprises a sealed tank filled with cooling liquid, fitted with a cover, inlet and outlet branch pipes which are interconnected with a circulation pump and a heat exchanger. Inside the tank parallel to its bottom the first printed-circuit board joined with the second printed-circuit board installed parallel to one of the tank walls is installed. The partition continuing to the tank wall is attached to the place of joining of the first and second printed-circuit boards. The computing unit consists of two assembly panels and motherboards parallel to each other mounted on the surfaces of assembly panels facing to each other. Radiators are adjoined tightly by two plates inclined towards to each other continuing closely to the first printed-circuit board and attached to the lower part of assembly panels. The computing unit is installed on the first printed-circuit board parallel to the second printed-circuit board. On the first printed-circuit board the holes for access to the cooled liquid through the first printed-circuit board to computing unit are made coaxially to each other. The spring mechanism is attached to the first printed-circuit board and intended for local shutting of passing of vertical flow of cooling liquid through the first printed-circuit board on such its section where the computing unit isn't installed. The server frame can comprise n tight tanks in parallel connected to each other by means of system of inlet and outlet pipelines which are interconnected with the outlet and inlet manifold pipes connected to each other by the common pressure head pipeline.EFFECT: improvement of efficiency of cooling of heating-up electronic components, increase of density of installation of computing units, ensuring of functioning of the server frame at negative ambient temperatures, and also preservation of efficiency of cooling and saving of the electric power at installation of incomplete quantity of computing units.11 cl, 6 dwg Изобретение относится к области вычислительной техники. Технический результат - повышение эффективности охлаждения нагревающихся электронных компонентов, увеличение плотности установки вычислительных узлов, обеспечение функционирования серверной фермы при отрицательных температурах окружающей среды, а также сохранение эффективности охлаждения и экономии электроэнергии при установке неполного