DIAMOND CUTOFF WHEEL

FIELD: machine building.SUBSTANCE: invention can be used in manufacturing of diamond cutoff wheels for cutting of hard and brittle materials such as ruby, sapphire, ceramics. A wheel comprises a disk casing with grooves for the depth of (0.05-0.1) of the diamond wheel width being made on its side su...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DOMNIN PETR VALER'EVICH, PETUKHOV JURIJ EVGEN'EVICH, RUBETS ANDREJ ALEKSANDROVICH, VODOVOZOV ALEKSANDR ALEKSEEVICH
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	GRINDING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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