SOLDER ALLOYS ON BASIS OF SILVER

FIELD: metallurgy. ^ SUBSTANCE: solder alloy can be used in jewellery industry, electronics, electrical engineering and instrument engineering. Solder alloy contains components in a following ratio, wt %: silver 39-41, copper 34-36, zinc 19-21, indium 4-6. Compounds of indium are virtually harmless...

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Bibliographische Detailangaben
Hauptverfasser:	SIDEL'NIKOV SERGEJ BORISOVICH, VINOGRADOV OLEG OLEGOVICH, USKOV IGOR' VASIL'EVICH, DOVZHENKO NIKOLAJ NIKOLAEVICH, BIRONT VITALIJ SEMENOVICH, BELJAEV SERGEJ VLADIMIROVICH, STOLJAROV ALEKSANDR VALENTINOVICH, LEBEDEVA OL'GA SERGEEVNA
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	FIELD: metallurgy. ^ SUBSTANCE: solder alloy can be used in jewellery industry, electronics, electrical engineering and instrument engineering. Solder alloy contains components in a following ratio, wt %: silver 39-41, copper 34-36, zinc 19-21, indium 4-6. Compounds of indium are virtually harmless for human's body. ^ EFFECT: decreasing of problems at manufacturing and application of particular solder alloy at manufacturing and expanding of manufacturing capabilities of application of particular solder alloy. ^ 2 tbl Припой может быть использован в ювелирной промышленности, электронике, электротехнике и приборостроении. Припой содержит компоненты в следующем соотношении, мас.%: серебро 39-41, медь 34-36, цинк 19-21, индий 4-6. Соединения индия практически безвредны для организма человека, что существенно снижает трудности при изготовлении и использовании данного припоя на производстве и расширяет технологические возможности применения данного припоя. 2 табл.