SOLDER PASTE

FIELD: physics. ^ SUBSTANCE: solder paste consists of following components in given ratio, wt %: tin-lead solder 83.125 - 91.875, pine oil 2.565 - 2.835, ethyl cellosolve 1.368 - 1.512, ethyl cellulose 0.1197 - 0.1323, common resin 4.4973 - 4.9707, acetic acid 0.8645 - 0.9555, triethylamine 2.4605 -...

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Bibliographische Detailangaben
1. Verfasser:	DIEV IGOR' SERAFIMOVICH
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	FIELD: physics. ^ SUBSTANCE: solder paste consists of following components in given ratio, wt %: tin-lead solder 83.125 - 91.875, pine oil 2.565 - 2.835, ethyl cellosolve 1.368 - 1.512, ethyl cellulose 0.1197 - 0.1323, common resin 4.4973 - 4.9707, acetic acid 0.8645 - 0.9555, triethylamine 2.4605 - 2.7195. ^ EFFECT: optimum combination of printing and adhesive parameters with complete exclusion of process of washing obtained joints after soldering. ^ 3 tbl