MULTILAYER PRINTED CIRCUIT BOARD WITH PROTECTION COAT

FIELD: electronics; printed circuit boards. ^ SUBSTANCE: multilayer printed circuit board consisting of signal dielectric layers comprising topological patterns of the printed wiring and interchanging with screening layers having the form of a grid provided with printed conductors reflecting the top...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	DANILOV OLEG ALEKSANDROVICH, ESIN JURIJ IVANOVICH, KLJUEV ALEKSEJ VASIL'EVICH, REBROV ANATOLIJ SEMENOVICH, SKACHKOV SERGEJ ANATOL'EVICH
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	FIELD: electronics; printed circuit boards. ^ SUBSTANCE: multilayer printed circuit board consisting of signal dielectric layers comprising topological patterns of the printed wiring and interchanging with screening layers having the form of a grid provided with printed conductors reflecting the topological pattern configuration of their nearest signal layer. Top layers of said printed circuit board are covered with a protection coat that consists of a mixture of ferrite powder and plastic binder based on protective varnishes or compounds and is applied by means of spreading, immersion or spraying. ^ EFFECT: enhancement of the quality of printed circuit board protection against effects of EMI.