METHOD OF DEFINING OF OPTIMAL CONDITIONS FOR POLISHING

FIELD: production methods. ^ SUBSTANCE: it is done the preliminary polishing of the processing detail and done the physical-mathematical analysis. With the result of the analysis it is changed the polishing conditions from elemental contain of the detail surface layer, its stage condition and macros...

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Bibliographische Detailangaben
Hauptverfasser:	EFREMOV VLADIMIR VLADIMIROVICH, PSHENICHKIN NIKOLAJ IVANOVICH, GELEVSKIJ ROMAN VLADIMIROVICH, GEDZ' ANDREJ DZHONOVICH, KOBERNICHENKO ANATOLIJ BORISOVICH
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	FIELD: production methods. ^ SUBSTANCE: it is done the preliminary polishing of the processing detail and done the physical-mathematical analysis. With the result of the analysis it is changed the polishing conditions from elemental contain of the detail surface layer, its stage condition and macrostructure. The mentioned parameters are defined by analysis of microdevice complex. It is includes the realization of x-ray stage analysis and slicing angel, x-ray photo-electrical spectroscope, mass-spectrometer and secondary ions with each layer analysis. At the same it is done the dimension of the micro-hardiness and roughness of processing surface. ^ EFFECT: it is increased the quality of processing surface. ^ 1 tbl,1 ex