SOLDERING METHOD

FIELD: manufacture of thin-wall parts arranged coaxially for forming ducts, possibly used in aviation and spatial technology. ^ SUBSTANCE: method is realized by soldering during two stages. Method comprises steps of applying coating on zone of joining parts for further joining of them; heating till...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: BIRKIN VIKTOR IVANOVICH, FROLOV IGOR' ALEKSEEVICH, TUSH ARKADIJ EVGEN'EVICH, KUDASHOV OLEG GEORGIEVICH
Format: Patent
Sprache:eng ; rus
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Beschreibung
Zusammenfassung:FIELD: manufacture of thin-wall parts arranged coaxially for forming ducts, possibly used in aviation and spatial technology. ^ SUBSTANCE: method is realized by soldering during two stages. Method comprises steps of applying coating on zone of joining parts for further joining of them; heating till temperature 760 - 780°C at rate 12°/min; then heating till temperature 815 - 820°C at rate 3°/min and soaking at such temperature for period no more than 2 min. Total time period before starting soldering mode is no more than 80 min. Coating thickness value before soldering is determined with use of expression bdesn = b0 (n/m) where bdesn - designed thickness value of coating, micrometers; b0 -initial thickness of coating, micrometer; n - lower value of evacuation degree; m - upper evacuation limit value. ^ EFFECT: improved reliability of joining outer cylindrical part and inner part with ribbed outer surface, prevention of duct melting through. ^ 2 dwg