METHOD FOR PREPARING OF WAFER PRODUCTS

FIELD: food-processing industry, in particular, production of confectioneries such as wafer products. ^ SUBSTANCE: method involves preparing wafer dough; forming wafer dough and baking; preparing filler by mixing receipt components; spreading filler onto wafer sheets; forming disk-shaped sheets from wafer dough, said sheets having thickness of 2-4 mm and diameter of 9-10 cm; cutting resultant wafer sheets into two layers; providing spreading of filler by applying hot filler onto one wafer layer, followed by closing of wafer layer containing filler spread thereon with second wafer layer, and pressing said layers by applying single pressing force from the top onto resultant product; cooling and packaging ready products; using stretchable milk-and-fat caramelized mass as filler. ^ EFFECT: simplified method, reduced processing time due to eliminating the process for spreading of filler on vast surface of wafer sheet and also the process of cutting wafer sheet, and improved quality of wafer product due to avoiding the possibility of breaking the structure of wafer product.