GLUING CURRENT-CONDUCTING COMPOSITION

FIELD: gluing compositions and materials. ^ SUBSTANCE: invention relates to a gluing current-conducting composition designated for fixing articles and providing electric hermeticity in wave-guide systems of electronic engineering technique. The composition comprises components taken in the following...

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Bibliographische Detailangaben
Hauptverfasser:	SIMUNOVA SVETLANA SERGEEVNA, ZAJCHENKO IVAN IVANOVICH, POTSEPNJA OREST ALEKSANDROVICH, BRYZGALINA GALINA VLADIMIROVNA, MITIN VLADIMIR ALEKSANDROVICH, CHUVILINA LJUBOV' FEDOROVNA
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	FIELD: gluing compositions and materials. ^ SUBSTANCE: invention relates to a gluing current-conducting composition designated for fixing articles and providing electric hermeticity in wave-guide systems of electronic engineering technique. The composition comprises components taken in the following ratio, mas. p. p: epoxydiane resin ED-20, 90-110; low-molecular polyamide resin L-20, 55-65; nickel powder of sort PNK-1L5, 500-600; technical cyclohexanone as a solvent, 80-120; titanium-organosilicon oligomer of cross-shaped structure of the general formula: Ti{[OSi(CH3)(C6H5)]2-5OH}4 representing product of TMPhT (tetrakis (methylphenylsiloxanehydroxy) titanium). Invention provides enhancing heat stability, increasing electric hermiticity of wave-guides and decreasing coefficient of stationary wave in wave-guide devices. ^ EFFECT: improved and valuable properties of composition. ^ 2 tbl, 3 ex