LAMINATED STRUCTURES AND THEIR MANUFACTURING METHODS

FIELD: laminated structures; microwave circuit manufacture. ^ SUBSTANCE: proposed laminated structure that has first and second conducting layers and support layer of material characterized in low dielectric constant, as well as first and second water-tight membranes can be treated by any method, su...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ALLEN SKOTT TIMON, NADZHAR AUSAMA, BISHKE UIL'JAM DZH, GAJLES CHESTAR LAJT
Format: Patent
Sprache:eng ; rus
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:FIELD: laminated structures; microwave circuit manufacture. ^ SUBSTANCE: proposed laminated structure that has first and second conducting layers and support layer of material characterized in low dielectric constant, as well as first and second water-tight membranes can be treated by any method, such as chemical etching, for producing microwave circuits from them. ^ EFFECT: enhanced resistance to acidic aqueous media , alkaline water media, and/or organic media. ^ 51 cl, 6 dwg, 7 ex