LAMINATED STRUCTURES AND THEIR MANUFACTURING METHODS
FIELD: laminated structures; microwave circuit manufacture. ^ SUBSTANCE: proposed laminated structure that has first and second conducting layers and support layer of material characterized in low dielectric constant, as well as first and second water-tight membranes can be treated by any method, su...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng ; rus |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | FIELD: laminated structures; microwave circuit manufacture. ^ SUBSTANCE: proposed laminated structure that has first and second conducting layers and support layer of material characterized in low dielectric constant, as well as first and second water-tight membranes can be treated by any method, such as chemical etching, for producing microwave circuits from them. ^ EFFECT: enhanced resistance to acidic aqueous media , alkaline water media, and/or organic media. ^ 51 cl, 6 dwg, 7 ex |
---|