SOLUTION FOR CHEMICAL NICKEL PLATING

FIELD: chemical technology. ^ SUBSTANCE: invention relates to chemical nickel plating of metals and alloys, in particular, aluminum, copper and its alloys. Invention proposes a solution containing nickel acetate, sodium hypophosphite, acetic acid and water in the following ratio of components: nicke...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MUKHIN VALERIJ ANATOL'EVICH, BELYKH NIKOLAJ ALEKSANDROVICH, NOSOVA MARINA ANATOL'EVNA, BORBAT VLADIMIR FEDOROVICH
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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