SOLUTION FOR CHEMICAL NICKEL PLATING

FIELD: chemical technology. ^ SUBSTANCE: invention relates to chemical nickel plating of metals and alloys, in particular, aluminum, copper and its alloys. Invention proposes a solution containing nickel acetate, sodium hypophosphite, acetic acid and water in the following ratio of components: nickel acetate, 19-21 g/l; sodium hypophosphite, 15-17 g/l, and acetic acid (rho = 1.05 g/cm3), 12-14 ml/l. Invention provides the development of the solution of simple composition used in chemical nickel plating such metal as aluminum and its alloys, copper and its alloys and steel and allowing to work at lower range of temperatures and providing good rate of the process, possibility for correction of the solution in case of prolonged working cycle, reducing the residual nickel content in the spent solution. Invention can be used in many branches of instrument making and machine engineering. ^ EFFECT: improved and valuable properties of solution. ^ 4 tbl