METHOD FOR PRODUCTION OF RELIEF IN FUNCTIONAL LAYER OF PRINT FORM
FIELD: metallography, possible use for forming submicron relief structures in functional layers of metallographic forms. ^ SUBSTANCE: in accordance to method, by means of at least one technological transition sides 4,5,6,7 of profiled linear groove 8 of pattern fragment 3 are formed by means of shap...
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Format: | Patent |
Sprache: | eng ; rus |
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Zusammenfassung: | FIELD: metallography, possible use for forming submicron relief structures in functional layers of metallographic forms. ^ SUBSTANCE: in accordance to method, by means of at least one technological transition sides 4,5,6,7 of profiled linear groove 8 of pattern fragment 3 are formed by means of shaping of functional layer of product 2. After full profile of groove 8 is formed, in internal corners of mating sections, at least parts of sections of curvilinear contour of groove 8 with different, relatively to base coordinates system, angular orientation, cold-hardening is removed which appeared during plastic deformation of material of functional layer during forming of profiled contour of groove 8. For that purpose in bisector area of aforementioned mating sections cuts 10 are made, directed towards area of groove 8 adjacent to bottom with exit of cutting part of tool onto upper plane of functional layer of product 2. Cuts 10 are made by shaping with length not exceeding size of side 4 or 5 of profile of groove 8 in direction of cut 10 in place where aforementioned cut 10 is made. Cut 10 is, as a rule, made during one pass of tool. ^ EFFECT: increased efficiency of process, increased precision and quality of processing due to elimination of cold-work strengthening. ^ 3 cl, 4 dwg |
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