MODULE FOR NON-CONTACT CHIP CARDS OR IDENTIFICATION SYSTEMS

MODULE FOR NON-CONTACT CHIP CARDS OR IDENTIFICATION SYSTEMS

FIELD: engineering of modules for non-contact chip-cards or identification systems. ^ SUBSTANCE: module contains first and second antenna contact stripes, which respectively have first and second oppositely positioned surfaces, semiconductor circuit board with at least two contact means, while at le...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KARL ANDREAS, PJUSHNER FRANK, MJULLER-KHIPPER ANDREAS
Format: Patent
Sprache:eng ; rus
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:FIELD: engineering of modules for non-contact chip-cards or identification systems. ^ SUBSTANCE: module contains first and second antenna contact stripes, which respectively have first and second oppositely positioned surfaces, semiconductor circuit board with at least two contact means, while at least one contact means is in contact with first surface of antenna contact stripe, and at least one other contact means is in contact with first surface of second antenna contact stripe, one stripe of gluing film, which at least partially covers first surface of both first and second antenna contact stripes while at least one stripe of gluing film is applied outside the zone, covered by aforementioned semiconductor circuit board. ^ EFFECT: provision of durability and stability during manufacture. ^ 6 cl, 3 dwg