NICKEL BASE SOLDER

FIELD: manufacture of soldered parts of radiators, heat exchangers, honeycomb boards and other structures including thin-wall members of stainless steels. ^ SUBSTANCE: solder contains next relation of ingredients, mass %: chrome, 3.0 - 17.9; iron, 0.1 - 10.0; molybdenum, 0.5 - 6.0; silicon, 3.0 -6.5...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHCHERBAKOV ANATOLIJ IVANOVICH, RYL'NIKOV VITALIJ SERGEEVICH, LUKIN VLADIMIR IVANOVICH, KABLOV EVGENIJ NIKOLAEVICH, STOLJANKOV JURIJ VLADISLAVOVICH, KALITSEV VIKTOR ANAN'EVICH
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	FIELD: manufacture of soldered parts of radiators, heat exchangers, honeycomb boards and other structures including thin-wall members of stainless steels. ^ SUBSTANCE: solder contains next relation of ingredients, mass %: chrome, 3.0 - 17.9; iron, 0.1 - 10.0; molybdenum, 0.5 - 6.0; silicon, 3.0 -6.5; cobalt, 0.1 - 10.0; niobium, 0.1 - 2.9; titanium, 0.1 - 2.9; boron, 1.2 - 1.6; manganese, 0.1 - 2.0; nickel, the balance. Solder in the form of amorphous metallic strip features improved technological plasticity, low erosion activity in relation to basic material, soldering temperature lower than 1100°C. ^ EFFECT: possibility for lowering mass of soldered structure, for improving technological effectiveness of soldering process due to high accuracy of solder dozing. ^ 2 tbl, 1 ex