HEAT-RESISTANT GLUE COMPOSITION
FIELD: adhesives. ^ SUBSTANCE: invention relates to heat-resistant modified glue compositions based on phenol-formaldehyde resins characterized by high strength of glued connections at 400-450°C and designed for gluing together various-destination structures, including aviation engineering parts. Co...
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| creator | KOTOVA ELENA VLADIMIROVNA ZASTROGINA OL'GA BORISOVNA TREBUKOVA ELENA ANDREEVNA ANIKHOVSKAJA LJUBOV' IVANOVNA KABLOV EVGENIJ NIKOLAEVICH PETROVA ALEFTINA PETROVNA SHVETS NATALIJA IVANOVNA LUKINA NATALIJA FILIPPOVNA |
| description | FIELD: adhesives. ^ SUBSTANCE: invention relates to heat-resistant modified glue compositions based on phenol-formaldehyde resins characterized by high strength of glued connections at 400-450°C and designed for gluing together various-destination structures, including aviation engineering parts. Composition comprises novolac phenol-formaldehyde resin, resol phenol-formaldehyde resin, organosilicon oligomer-hydroxyl-containing titanium-organosilicon oligomer in the form of acetone solution, organic solvent (ethyl alcohol), and fillers: aluminum powder and amorphous boron. ^ EFFECT: increased sheer strength of glued connections at high temperatures with initial strength of glued connections preserved. ^ 2 tbl, 4 ex |
| format | Patent |
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| language | eng ; rus |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| title | HEAT-RESISTANT GLUE COMPOSITION |
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