HEAT-RESISTANT GLUE COMPOSITION

FIELD: adhesives. ^ SUBSTANCE: invention relates to heat-resistant modified glue compositions based on phenol-formaldehyde resins characterized by high strength of glued connections at 400-450°C and designed for gluing together various-destination structures, including aviation engineering parts. Co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KOTOVA ELENA VLADIMIROVNA, ZASTROGINA OL'GA BORISOVNA, TREBUKOVA ELENA ANDREEVNA, ANIKHOVSKAJA LJUBOV' IVANOVNA, KABLOV EVGENIJ NIKOLAEVICH, PETROVA ALEFTINA PETROVNA, SHVETS NATALIJA IVANOVNA, LUKINA NATALIJA FILIPPOVNA
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	FIELD: adhesives. ^ SUBSTANCE: invention relates to heat-resistant modified glue compositions based on phenol-formaldehyde resins characterized by high strength of glued connections at 400-450°C and designed for gluing together various-destination structures, including aviation engineering parts. Composition comprises novolac phenol-formaldehyde resin, resol phenol-formaldehyde resin, organosilicon oligomer-hydroxyl-containing titanium-organosilicon oligomer in the form of acetone solution, organic solvent (ethyl alcohol), and fillers: aluminum powder and amorphous boron. ^ EFFECT: increased sheer strength of glued connections at high temperatures with initial strength of glued connections preserved. ^ 2 tbl, 4 ex