COMPOSITION FOR HEAT-CONDUCTING GLUE FORMULATION

FIELD: adhesives. ^ SUBSTANCE: invention relates to epoxide compositions for preparing heat-conducting glue formulations intended to join metals: steels, aluminum and titanium alloys, and ceramics to extract heat from heated members of instruments and to cool heavy-duty units and parts. Composition may be employed as sealing protective heat-extracting coating or layer in electrical and other appliances or to join and to seal parts of glass, ferrite, ceramics, aluminum, steel, and other materials. Composition contains epoxide 4,4'-isopropylidenediphenol resin, aliphatic amines as hardener, boron nitrile as heat-conducting filler, polyoxypropylenetriol triglycedyl ether (Laproksid 603), butylcellosolve monoglycedyl ether (Laproksid 301), and low-molecular weight polyamide resin. ^ EFFECT: enabled preparation of heat-conducting cold-cure glue formulation with high heat conductivity combined with sufficient adhesion shear strength and cohesion stretching strength. ^ 2 tbl