MICROCOOLING DEVICE

FIELD: cooling equipment, particularly heat exchange apparatuses. ^ SUBSTANCE: device to remove heat from heat-generation component includes coolant stored in liquid coolant storage part, heat absorbing part including at least one the first microchannel and installed near heat-generation component....

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Bibliographische Detailangaben
1. Verfasser:	LI DZUNG KHIUN
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COLD ROOMS COMBINED HEATING AND REFRIGERATION SYSTEMS COOLING OR FREEZING APPARATUS NOT COVERED BY ANY OTHERSUBCLASS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT PUMP SYSTEMS HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING ICE-BOXES LIGHTING LIQUEFACTION SOLIDIFICATION OF GASES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE OR STORAGE OF ICE MECHANICAL ENGINEERING PRINTED CIRCUITS REFRIGERATION OR COOLING REFRIGERATORS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	FIELD: cooling equipment, particularly heat exchange apparatuses. ^ SUBSTANCE: device to remove heat from heat-generation component includes coolant stored in liquid coolant storage part, heat absorbing part including at least one the first microchannel and installed near heat-generation component. Heat absorbing part communicates with storage part. Liquid coolant partly fills microchannel due to surface tension force and evaporates into above microchannel with gaseous coolant generation during absorbing heat from heat generation component. Device has coolant condensing part including at least one the second microchannel connected to above coolant storage part separately from the first microchannel, gaseous coolant movement part located near heat-absorbing part and condensing part and used for gaseous coolant movement from the first microchannel to the second one. Device has case in which at least heat-absorbing part is placed and heat-insulation part adjoining heat absorbing part to prevent heat absorbed by above part from migration to another device parts. ^ EFFECT: reduced size, increased refrigeration capacity, prevention of gravity and equipment position influence on device operation. ^ 22 cl, 4 dwg