METHOD FOR SOLDERING HONEYCOMB PANELS

FIELD: manufacture of complex-profile panels with variable cross section, for example hollow vanes of fan of aircraft engine. ^ SUBSTANCE: honeycomb panels includes boards between which honeycomb fillers are arranged. Method comprises steps of placing solder in soldering zone; assembling soldered pa...

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Bibliographische Detailangaben
Hauptverfasser:	LASHKOV V.I, KOSTENKO I.F, KARASEV V.M, URZHUNTSEV M.A, LIPATOV A.S
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	FIELD: manufacture of complex-profile panels with variable cross section, for example hollow vanes of fan of aircraft engine. ^ SUBSTANCE: honeycomb panels includes boards between which honeycomb fillers are arranged. Method comprises steps of placing solder in soldering zone; assembling soldered panels at forcing boards one to other; heating them until soldering temperature and cooling. Boards are forced one to other by means of fitting at predetermined temperature condition of plastic deformation lower than solder melting temperature by 50 -250 C. At least two parts of fitting are used for forcing boards. Cooling is realized at minimally admissible temperature gradient along length of panel at heating portion of panel of less cross section. Method allows to prevent undesirable deformations of thin-wall panels, non-soldered spots and non-uniform soldered joint. ^ EFFECT: enhanced quality of soldered panels. ^ 3 cl, 1 dwg, 1 tbl