COMPOSITION SOLDERING METHOD

FIELD: electronics, namely soldering different type materials, mainly metals with silicon, with quartz glass, ceramics. ^ SUBSTANCE: method comprises steps of using for soldering composition type solder containing solid-phase porous ferromagnetic matrix and easy-to-melt diamagnetic component; placin...

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Bibliographische Detailangaben
Hauptverfasser:	KANCHUKOEV V.Z, SOZAEV V.A, UNEZHEV M.L, PONEZHEV M.KH, AKHKUBEKOV A.A
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	FIELD: electronics, namely soldering different type materials, mainly metals with silicon, with quartz glass, ceramics. ^ SUBSTANCE: method comprises steps of using for soldering composition type solder containing solid-phase porous ferromagnetic matrix and easy-to-melt diamagnetic component; placing assembly prepared for soldering in magnetic field according to condition of increased capillary force acting upon easy-to-melt component due to creation of magnetic effort pulling it out of ferromagnetic matrix; performing soldering at temperature lower than that of magnetic conversion of solid-phase matrix. ^ EFFECT: possibility for receiving strength joints with predetermined thickness, physical and mechanical properties. ^ 2 ex