EPOXIDE OLIGOMER FOR BINDING COMPOSITION, METHOD FOR PREPARATION THEREOF, AND A METHOD FOR PREPARING BINDING COMPOSITION BASED ON THIS OLIGOMER

FIELD: polymer production. SUBSTANCE: epoxide oligomer with molecular weight 1500-2000 is prepared via epoxidation of conjugated aromatic hydroxyphenylene with toluene solution of diphenylolpropane-based epoxide resin having molecular weight 350-380, said epoxidation being carried out at 95-115 C in presence of 2-methylimidazole catalyst in concentration 0.03- 0.035% of the weight of resin. Hydroxyphenylene is prepared by oxidative polycondensation of one of resorcin, pyrocatechol, and alkylresorcin. Epoxidation impurities until epoxide oligomer with 8-10 wt % epoxide group content. Binding composition is prepared by adding aromatic diamine hardener to epoxide oligomer. Addition is performed portionwise under stirring at 10 to 110 until transparent solution is obtained. EFFECT: increased reactivity and vitality of epoxide oligomer, eliminated UV radiation effect, increased chemical stability, heat resistance, and dimensional constancy. 6 cl, 1 tbl