COMPOSITION MATERIAL

FIELD: powder metallurgy, namely production of composition material that may be used, for example in semiconductor devices. SUBSTANCE: composition material including metal and inorganic particles having thermal expansion factor less than that of used metal and dispersed in metal in such a way that a...

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Bibliographische Detailangaben
Hauptverfasser:	MASAKHISA INAGAKI, JASUKHISA AONO, TERUESHI ABE, JUNJA KANEDA, RJUICHI SAITO, KHIDEO ARAKAVA, JASUO KONDO, ESHIKHIKO KOIKE
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CASTING CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS POWDER METALLURGY SEMICONDUCTOR DEVICES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	FIELD: powder metallurgy, namely production of composition material that may be used, for example in semiconductor devices. SUBSTANCE: composition material including metal and inorganic particles having thermal expansion factor less than that of used metal and dispersed in metal in such a way that at least 95% of particles (according to their area in cross section) form mutually joined complex-shape aggregates. Material contains no more than 100 separate inorganic particles per 100 sq.micrometers of its cross section area. In temperature range 20 -150 C thermal expansion factor of material increases in average by (0,025-0,035)x10-6/°C at change of heat conductivity at 20C by 1Wt/(m x K). Such material may include copper and copper oxide particles. EFFECT: material having low thermal expansion factor and high heat conductivity and easily subjected to plastic working. 5 cl, 21 dwg, 4 tbl, 11 ex