SEMICONDUCTOR PLATE GRINDER

mechanical engineering; production of semiconductor devices. SUBSTANCE: proposed grinder consists of housing including central cylindrical, middle and peripheral ring pneumatic chambers divided by cylindrical partitions and communicating with compressed air feed lines. Plate rotating drive is made in form of fixed truncated cone. Central hole, inclined tangential and radial nozzles connected with corresponding pneumatic chambers are made in smaller base-bottom of conical seat of fixed truncated cone. Tangential nozzles are located at angle to surface of lower base of truncated cone tangentially to their location circumference concentric with conical surface. Inclined radial nozzles are directed at angle to surface of truncated cone lower base along radius of circumference of their location, larger circumference of location of inclined tangential nozzles and concentric conical surface. Diameter of grinding tool is less than diameter of upper base of truncated cone, tool being connected with housing by means of lever and joint. Proposed device excludes auxiliary operations for fastening plate, provides possibility of simultaneously cooling and grinding of plates made of semiconductor materials with low physical and mechanical properties and adjusting meters pressure of plate to grinding surface. EFFECT: reduced reject. 5 dwg