PROCESS OF MANUFACTURE OF SUPPORTING ELEMENT FOR SEMICONDUCTOR CHIPS

electronics. SUBSTANCE: process is related to attachment of semiconductor devices to solid body, to attachment of semiconductor chips to supporting element. Supporting element for semiconductor chip 23, specifically, for assembly in chip card incorporates substrate 15, carrying chip 23 and rigidity...

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Bibliographische Detailangaben
Hauptverfasser:	SHTAMPKA PETER, GRAF KHEL'MUT, KHUBER MIKHEL, UDO DETLEF, KHAJTTSER JOZEF, FISHER JURGEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	electronics. SUBSTANCE: process is related to attachment of semiconductor devices to solid body, to attachment of semiconductor chips to supporting element. Supporting element for semiconductor chip 23, specifically, for assembly in chip card incorporates substrate 15, carrying chip 23 and rigidity film 10 laminated on substrate side carrying chip with recess 14 for location of chip and its leads 24 which edge is fitted with frame 12 manufactured as one unit with film 10. EFFECT: simplified process of manufacture of supporting elements for semiconductor chip. 7 cl, 5 dwg