ELECTROLYTE FOR APPLICATION OF COPPER COATING

electroplating, particularly, application of copper coatings; in various branches of industry. SUBSTANCE: electrolyte contains, g/l: pentaaquo-copper sulfate, 5-100; copper diglycinate -Ci(Gly)2, 40-150; aminoacetic acid Gly, 0.25-1; sodium sulfate, 30-130; organic additive, 0.5-5. In addition, orga...

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Bibliographische Detailangaben
Hauptverfasser:	ANDREEV A.V, KATKOV A.EH
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	electroplating, particularly, application of copper coatings; in various branches of industry. SUBSTANCE: electrolyte contains, g/l: pentaaquo-copper sulfate, 5-100; copper diglycinate -Ci(Gly)2, 40-150; aminoacetic acid Gly, 0.25-1; sodium sulfate, 30-130; organic additive, 0.5-5. In addition, organic additive in electrolyte may be used in the form of mono- or polysaccharides. EFFECT: higher cohesion of coating with metal and increased coating strength due to deposition of copper from nontoxic complex aminoacetate compound in presence of background electrolyte (sodium sulfate) and buffer system based on aminoacetic acid. 4 cl, 2 tbl