APPARATUS FOR GRINDING SEMICONDUCTOR PLATES

manufacture of semiconductor instruments, machine engineering. SUBSTANCE: apparatus has housing in the form of cylinder with central opening whose diameter is more than that of ground plate. Housing includes inner, mean and peripheral concentric annular pneumatic chambers closed from upwards by roun...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GREBENKIN O.M, POPOV G.V, BITJUKOV V.K, ABRAMOV G.V
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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