APPARATUS FOR GRINDING SEMICONDUCTOR PLATES

manufacture of semiconductor instruments, machine engineering. SUBSTANCE: apparatus has housing in the form of cylinder with central opening whose diameter is more than that of ground plate. Housing includes inner, mean and peripheral concentric annular pneumatic chambers closed from upwards by round cover. Said chambers are connected in upper portions with lines for supplying compressed air. Drive unit for moving ground plate is in the form of stationary sleeve joined with round grinding abrasive member having central opening and with housing. In base of housing there are inclined tangential nozzles, vertical nozzles and inclined radial nozzles arranged along concentric circles. Tangential nozzles are inclined relative to tangent lines to circle of their arrangement and to surface of base and they are connected with inner pneumatic chamber. Vertical nozzles are connected with mean pneumatic chamber, radial nozzles are connected with peripheral pneumatic chamber and they are inclined relative to base surface. Pickup for detecting revolution number of ground plate is placed in base. Apparatus has no mechanically moving parts and it provides simultaneous cooling at grinding and at working plates made of semiconductor material with low physicomechanical properties. EFFECT: decreased number of rejected plates due to simple regulation of effort for pressing plates to grinding surface. 7 dwg