METHOD OF PREPARATION OF SUBSTRATE FOR BONDING

construction engineering; method of mechanical preparation of substrate for bonding. SUBSTANCE: method includes roughing of substrate surface. Innovation on invention consists in forming relief from evenly distributed members on surface of substrate. Number of these members, their parameters, amount...

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Bibliographische Detailangaben
Hauptverfasser:	SHABROV V.L, JAKOVLEV I.V, DOBROKHOTOV V.B, LEBEDEV A.B, PRIDATKO JU.M, TIMOFEEV D.V
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	construction engineering; method of mechanical preparation of substrate for bonding. SUBSTANCE: method includes roughing of substrate surface. Innovation on invention consists in forming relief from evenly distributed members on surface of substrate. Number of these members, their parameters, amount of embedding in substrate depend on property of adhesive, deformability and stress in adhesive joint. EFFECT: improved quality of adhesive joint (increased strength) of substrate and adhesive. 1 tbl