ELECTRODE CLAMPING DEVICE, METHOD FOR ITS ASSEMBLY AND USE

plasma treatment of semiconductor plates. SUBSTANCE: device used for flexible clamping of electrode in supporting unit has supporting member with its lower surface facing the plate to be treated in reaction chamber, electrode with its lower surface facing the plate and upper surface of outer edge fa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	EHRIK KH. LENTS, MAJKL L. KALVIZI, ROBERT A. FREJZER, IVO A. MILLER
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	plasma treatment of semiconductor plates. SUBSTANCE: device used for flexible clamping of electrode in supporting unit has supporting member with its lower surface facing the plate to be treated in reaction chamber, electrode with its lower surface facing the plate and upper surface of outer edge facing lower surface of supporting member, and clamping member engageable with outer edge of electrode; clamping member provides for flexible clamping of electrode in supporting member. Method for device assembly and for plate etching by means of mentioned electrode is given in description of invention. EFFECT: improved plenarily from electrode center to periphery with critical dimensions maintained within desired limits. 29 cl, 8 dwg