METHOD AND DEVICE FOR PRODUCING PHOTORESIST COATING

microelectronics; logarithmic operations in semiconductor device and integrated circuit manufacture. SUBSTANCE: method includes coating substrate with photoresist dose, shaping layer, and pre-drying it. Substrate is placed on swirling-air underlayer, accelerated to definite speed, covered with photoresist layer, and air used for creating swirling-air space is heated upon throwing off excess photoresist to definite temperature; then substrate is allowed to dry out and cooled down to ambient temperature. Device implementing this method has case accommodating air chamber communicating with fresh air and vacuum supply lines and with working region on one of its external sides for plate mounting that communicates with air chamber; it also has control unit communicating with fresh air and vacuum supply lines. Device incorporates temperature sensor mounted on working surface of centrifuge and connected to heating element located inside air chamber through temperature control unit. EFFECT: improved quality of photoresist layer. 2 cl, 1 dwg, 1 tbl