INTEGRAL CIRCUIT ASSEMBLY

FIELD: radio engineering, in particular, for embedding integral circuits into cards. SUBSTANCE: invention discloses device design which provides targeted control of heat flow which enters integral circuit assembly from outside due to either heat insulation layer introduced between flexible carrying...

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Hauptverfasser: JOZEF KIRSHBAUER, PETER SHTAMPKA, KHANS-GEORG MENSH, KHANS-KHINNERK SHTEKKHAN, DETLEF UDO
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Sprache:eng
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creator JOZEF KIRSHBAUER
PETER SHTAMPKA
KHANS-GEORG MENSH
KHANS-KHINNERK SHTEKKHAN
DETLEF UDO
description FIELD: radio engineering, in particular, for embedding integral circuits into cards. SUBSTANCE: invention discloses device design which provides targeted control of heat flow which enters integral circuit assembly from outside due to either heat insulation layer introduced between flexible carrying ribbon of integral circuit assembly and integral circuit glued over it, or recesses in surface or layer of metal contacts. Heat flow from hollow upper die which is located in external region of metal contacts is interrupted in direction towards integral circuit which is mounted in center. EFFECT: prevention peelings between cover body and integral circuit which is embedded by means of hot gluing. 4 cl, 4 dwg
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_RU2145732C1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>RU2145732C1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_RU2145732C13</originalsourceid><addsrcrecordid>eNrjZJD09AtxdQ9y9FFw9gxyDvUMUXAMDnb1dfKJ5GFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8UGhRoYmpubGRs6GxkQoAQDgox_J</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>INTEGRAL CIRCUIT ASSEMBLY</title><source>esp@cenet</source><creator>JOZEF KIRSHBAUER ; PETER SHTAMPKA ; KHANS-GEORG MENSH ; KHANS-KHINNERK SHTEKKHAN ; DETLEF UDO</creator><creatorcontrib>JOZEF KIRSHBAUER ; PETER SHTAMPKA ; KHANS-GEORG MENSH ; KHANS-KHINNERK SHTEKKHAN ; DETLEF UDO</creatorcontrib><description>FIELD: radio engineering, in particular, for embedding integral circuits into cards. SUBSTANCE: invention discloses device design which provides targeted control of heat flow which enters integral circuit assembly from outside due to either heat insulation layer introduced between flexible carrying ribbon of integral circuit assembly and integral circuit glued over it, or recesses in surface or layer of metal contacts. Heat flow from hollow upper die which is located in external region of metal contacts is interrupted in direction towards integral circuit which is mounted in center. EFFECT: prevention peelings between cover body and integral circuit which is embedded by means of hot gluing. 4 cl, 4 dwg</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BOOK COVERS ; BOOKBINDING ; CALCULATING ; COMPUTING ; COUNTING ; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILES ; HANDLING RECORD CARRIERS ; LOOSE LEAVES ; MOVABLE-STRIP WRITING OR READING APPARATUS ; PERFORMING OPERATIONS ; PHYSICS ; PRESENTATION OF DATA ; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES ; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR ; RECOGNITION OF DATA ; RECORD CARRIERS ; SEMICONDUCTOR DEVICES ; SPECIAL PRINTED MATTER ; TRANSPORTING</subject><creationdate>2000</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20000220&amp;DB=EPODOC&amp;CC=RU&amp;NR=2145732C1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20000220&amp;DB=EPODOC&amp;CC=RU&amp;NR=2145732C1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JOZEF KIRSHBAUER</creatorcontrib><creatorcontrib>PETER SHTAMPKA</creatorcontrib><creatorcontrib>KHANS-GEORG MENSH</creatorcontrib><creatorcontrib>KHANS-KHINNERK SHTEKKHAN</creatorcontrib><creatorcontrib>DETLEF UDO</creatorcontrib><title>INTEGRAL CIRCUIT ASSEMBLY</title><description>FIELD: radio engineering, in particular, for embedding integral circuits into cards. SUBSTANCE: invention discloses device design which provides targeted control of heat flow which enters integral circuit assembly from outside due to either heat insulation layer introduced between flexible carrying ribbon of integral circuit assembly and integral circuit glued over it, or recesses in surface or layer of metal contacts. Heat flow from hollow upper die which is located in external region of metal contacts is interrupted in direction towards integral circuit which is mounted in center. EFFECT: prevention peelings between cover body and integral circuit which is embedded by means of hot gluing. 4 cl, 4 dwg</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BOOK COVERS</subject><subject>BOOKBINDING</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILES</subject><subject>HANDLING RECORD CARRIERS</subject><subject>LOOSE LEAVES</subject><subject>MOVABLE-STRIP WRITING OR READING APPARATUS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES</subject><subject>PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPECIAL PRINTED MATTER</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2000</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD09AtxdQ9y9FFw9gxyDvUMUXAMDnb1dfKJ5GFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8UGhRoYmpubGRs6GxkQoAQDgox_J</recordid><startdate>20000220</startdate><enddate>20000220</enddate><creator>JOZEF KIRSHBAUER</creator><creator>PETER SHTAMPKA</creator><creator>KHANS-GEORG MENSH</creator><creator>KHANS-KHINNERK SHTEKKHAN</creator><creator>DETLEF UDO</creator><scope>EVB</scope></search><sort><creationdate>20000220</creationdate><title>INTEGRAL CIRCUIT ASSEMBLY</title><author>JOZEF KIRSHBAUER ; PETER SHTAMPKA ; KHANS-GEORG MENSH ; KHANS-KHINNERK SHTEKKHAN ; DETLEF UDO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_RU2145732C13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2000</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BOOK COVERS</topic><topic>BOOKBINDING</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILES</topic><topic>HANDLING RECORD CARRIERS</topic><topic>LOOSE LEAVES</topic><topic>MOVABLE-STRIP WRITING OR READING APPARATUS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES</topic><topic>PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPECIAL PRINTED MATTER</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>JOZEF KIRSHBAUER</creatorcontrib><creatorcontrib>PETER SHTAMPKA</creatorcontrib><creatorcontrib>KHANS-GEORG MENSH</creatorcontrib><creatorcontrib>KHANS-KHINNERK SHTEKKHAN</creatorcontrib><creatorcontrib>DETLEF UDO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JOZEF KIRSHBAUER</au><au>PETER SHTAMPKA</au><au>KHANS-GEORG MENSH</au><au>KHANS-KHINNERK SHTEKKHAN</au><au>DETLEF UDO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INTEGRAL CIRCUIT ASSEMBLY</title><date>2000-02-20</date><risdate>2000</risdate><abstract>FIELD: radio engineering, in particular, for embedding integral circuits into cards. SUBSTANCE: invention discloses device design which provides targeted control of heat flow which enters integral circuit assembly from outside due to either heat insulation layer introduced between flexible carrying ribbon of integral circuit assembly and integral circuit glued over it, or recesses in surface or layer of metal contacts. Heat flow from hollow upper die which is located in external region of metal contacts is interrupted in direction towards integral circuit which is mounted in center. EFFECT: prevention peelings between cover body and integral circuit which is embedded by means of hot gluing. 4 cl, 4 dwg</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
BOOK COVERS
BOOKBINDING
CALCULATING
COMPUTING
COUNTING
DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FILES
HANDLING RECORD CARRIERS
LOOSE LEAVES
MOVABLE-STRIP WRITING OR READING APPARATUS
PERFORMING OPERATIONS
PHYSICS
PRESENTATION OF DATA
PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES
PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
SPECIAL PRINTED MATTER
TRANSPORTING
title INTEGRAL CIRCUIT ASSEMBLY
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