INTEGRAL CIRCUIT ASSEMBLY

FIELD: radio engineering, in particular, for embedding integral circuits into cards. SUBSTANCE: invention discloses device design which provides targeted control of heat flow which enters integral circuit assembly from outside due to either heat insulation layer introduced between flexible carrying...

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Bibliographische Detailangaben
Hauptverfasser:	JOZEF KIRSHBAUER, PETER SHTAMPKA, KHANS-GEORG MENSH, KHANS-KHINNERK SHTEKKHAN, DETLEF UDO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BOOK COVERS BOOKBINDING CALCULATING COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILES HANDLING RECORD CARRIERS LOOSE LEAVES MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SEMICONDUCTOR DEVICES SPECIAL PRINTED MATTER TRANSPORTING
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Beschreibung
Zusammenfassung:	FIELD: radio engineering, in particular, for embedding integral circuits into cards. SUBSTANCE: invention discloses device design which provides targeted control of heat flow which enters integral circuit assembly from outside due to either heat insulation layer introduced between flexible carrying ribbon of integral circuit assembly and integral circuit glued over it, or recesses in surface or layer of metal contacts. Heat flow from hollow upper die which is located in external region of metal contacts is interrupted in direction towards integral circuit which is mounted in center. EFFECT: prevention peelings between cover body and integral circuit which is embedded by means of hot gluing. 4 cl, 4 dwg