METHOD OF VACUUM DEPOSITION OF THIN FILMS

FIELD: applied physics, particularly, methods of vacuum deposition of thin films onto surface of solid body. SUBSTANCE: method includes simultaneous deposition of substance slow atoms and radiation of surface with accelerated particles in the form of atoms of deposited substance and atoms of other s...

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Bibliographische Detailangaben
Hauptverfasser:	VOLOSOV V.I, STESHOV A.G, CHURKIN I.N
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	FIELD: applied physics, particularly, methods of vacuum deposition of thin films onto surface of solid body. SUBSTANCE: method includes simultaneous deposition of substance slow atoms and radiation of surface with accelerated particles in the form of atoms of deposited substance and atoms of other substances accelerated to energy of at least 300 eV. Slow and accelerated atoms may be provided by one source or by separate sources. Solid body may be located in atmosphere of active gas. EFFECT: reduced cost of method realization, maintenance cost and higher productivity and stability in operation, improved quality of deposited thin films. 2 cl, 2 dwg