LIGHT-EMITTING DIODE UNIT

FIELD: electronic engineering. SUBSTANCE: diode unit has emitter, emitter holder incorporating metal or metallized substrate with connecting leads of which at least one is insulated from substrate, as well as sealed case with cover; the latter carries light-concentrating lens in the form of sphere-...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BELEN'KOV N.M, UVAROV L.A, ABRAMOV V.S, DENISOV S.D, SHCHERBAKOV N.V
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:FIELD: electronic engineering. SUBSTANCE: diode unit has emitter, emitter holder incorporating metal or metallized substrate with connecting leads of which at least one is insulated from substrate, as well as sealed case with cover; the latter carries light-concentrating lens in the form of sphere- or ellipse- shaped cylinder with respective base; provided on bottom face of cover base are guide pins located against respective position holes in substrate; a few, at least two, separate single- or different-color optical-range semiconductor chips mounted on their common substrate function as emitter; substrate has depression with planar bottom to receive chips which functions to emit light by its side surface in the form of surface of body of revolution, primarily truncated-cone surface; number of seats for emitter chips in depression and number of insulated leads in substrate correspond to number of chips; in addition, thickness of lens cylindrical base does not exceed radius of its semi-sphere, respectively, of smaller of two semi-axes of its elliptical cross-sectional area; substrate thickness equals four or more thicknesses of light-emitting chips; depth of planar seat is at least two times greater than thickness of light- emitting chips but does not exceed thickness of four chips; diameter of seat for every separate chip is greater than diagonal of bottom face of respective chip but it does not exceed mentioned diagonal by more than 1.5 times; space between cylindrical base and top surface of substrate in proposed unit is filled with sealing compound; joint between each conductor and respective insulated lead is covered with conductive adhesive layer. EFFECT: improved emissive power and provision for varying angle of vision and spatial directivity pattern of light. 12 cl, 3 dwg, 3 tbl