SURFACE ACOUSTIC WAVE ELEMENT AND METHOD FOR MANUFACTURING ITS DAMPING STRUCTURE

FIELD: processing information-bearing electromagnetic wave signals. SUBSTANCE: damping structure proposed for surface acoustic wave element is made of cation-cured epoxy resin with ultraviolet light initiation. Solvent-free epoxy resin is based on cycloaliphatic epoxide and applied to substrate by s...

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Bibliographische Detailangaben
Hauptverfasser:	VOL'FGANG PAL, KHAJNER BAJER, KHANS SHTELTSL, VAL'TER FISHER, VINFRID PLUNDRIKH
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	ACOUSTICS ACOUSTICS NOT OTHERWISE PROVIDED FOR BASIC ELECTRONIC CIRCUITRY CHEMISTRY COMPOSITIONS BASED THEREON ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING,NOISE OR OTHER ACOUSTIC WAVES IN GENERAL MUSICAL INSTRUMENTS ORGANIC MACROMOLECULAR COMPOUNDS PHYSICS RESONATORS SOUND-PRODUCING DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	FIELD: processing information-bearing electromagnetic wave signals. SUBSTANCE: damping structure proposed for surface acoustic wave element is made of cation-cured epoxy resin with ultraviolet light initiation. Solvent-free epoxy resin is based on cycloaliphatic epoxide and applied to substrate by silk screening method. When substrate is cut apart, damping mass may be sawed through without separation or exfoliation. EFFECT: facilitated manufacture, reduced reflection on edges, improved damping for dissipation signals. 9 cl, 1 dwg