SOURCE OF MULTICOMPONENT NUCLEAR FLOWS

FIELD: electrical engineering, in particular, vacuum deposition of thin films. SUBSTANCE: device is designed as rotating plasma trap which generates multicomponent nuclear flows which consist of fast nuclei which energy is determined discharge voltage. EFFECT: increased power, simplified design, dec...

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Bibliographische Detailangaben
Hauptverfasser:	VOLOSOV V.I, STESHOV A.G, CHURKIN I.N
Format:	Patent
Sprache:	eng ; rus
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	FIELD: electrical engineering, in particular, vacuum deposition of thin films. SUBSTANCE: device is designed as rotating plasma trap which generates multicomponent nuclear flows which consist of fast nuclei which energy is determined discharge voltage. EFFECT: increased power, simplified design, decreased cost of manufacturing and use. 2 dwg