PLATINUM BASED SOLDER FOR SOLDERING JEWELRY

FIELD: medical and electrical industries. SUBSTANCE: solder comprises (wt %): 1-3 silicon; 2-16 palladium; and the platinum balance. Solder has lower melting temperature and assures higher strength of soldered joint. Standard of fineness and color identity of backing and soldered joint of final jewe...

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Bibliographische Detailangaben
Hauptverfasser:	ERMAKOV A.V, DMITRIEV V.A, NIKIFOROV S.V, GOLIKOVA N.N, TIMOFEEV N.I
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	FIELD: medical and electrical industries. SUBSTANCE: solder comprises (wt %): 1-3 silicon; 2-16 palladium; and the platinum balance. Solder has lower melting temperature and assures higher strength of soldered joint. Standard of fineness and color identity of backing and soldered joint of final jewelry are retained. EFFECT: improved properties of the final jewelry. 1 dwg, 1 tble