EPOXY MOLDED MATERIAL

FIELD: production of molded materials on the base of epoxy resins. SUBSTANCE: epoxy molded material comprises, wt.p.: prepolymer, 100; -diaminodiphenyl methane, 10-20; anti-adhesive additive, 6-12; coloring additive, 0.2-1.0; glass fiber filler, 150-280. Prepolymer is prepared by interaction of epox...

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Bibliographische Detailangaben
Hauptverfasser:	TROFIMOV N.N, LAPITSKIJ V.A, NATRUSOV V.I
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	FIELD: production of molded materials on the base of epoxy resins. SUBSTANCE: epoxy molded material comprises, wt.p.: prepolymer, 100; -diaminodiphenyl methane, 10-20; anti-adhesive additive, 6-12; coloring additive, 0.2-1.0; glass fiber filler, 150-280. Prepolymer is prepared by interaction of epoxy diane resin (its molecular weight being 340-600) with -diaminodiphenyl sulfone, phenol formaldehyde novolac and with p-aminobenzyl aniline at their mass ratio (70-90):(6-18):(2-8):(2-4), respectively. Components are mixed all together within 90 m and then are rolled. EFFECT: improved quality of product. 2 tbl-