METHOD FOR COPPER PLATING OF WIRE

FIELD: hardware production; may be used in copper plating of wire made of alloyed and low-carbon steel. SUBSTANCE: method includes successive stages: the first washing at temperature of 40-60 C, chemical activation, contact copper plating, the second washing, pull branch, elastoplastic bending at ea...

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Bibliographische Detailangaben
Hauptverfasser:	LEBEDEV A.A, ZHILKINA V.F, ZUEV B.M, ZJUZIN V.I, RUCHUSHKIN N.I, TEMNIKOV S.F, SAVEL'EV E.V, ALEKSANDROV B.L, GOSTENIN V.A, KULESHA V.A
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	FIELD: hardware production; may be used in copper plating of wire made of alloyed and low-carbon steel. SUBSTANCE: method includes successive stages: the first washing at temperature of 40-60 C, chemical activation, contact copper plating, the second washing, pull branch, elastoplastic bending at each stage and passing after each stage through wiper. Distinguishing feature of the method consists in additional densifying and calibrating pull broaching at the stage of contact copper plating. EFFECT: higher density, uniformity and optimal thickness of coating without reduction of attained productivity. 4 cl, 1 tblp