METHOD OF MAKING SOLDERED TELESCOPIC STRUCTURES

METHOD OF MAKING SOLDERED TELESCOPIC STRUCTURES

FIELD: power machine engineering, namely soldering thick wall telescopic structures. SUBSTANCE: structure includes outer 1 and inner 2 envelopes with thin-wall compensating member 3 having end in hard-to-reach zone. Outer envelope has turning 5 and groove 6. Nickel coat is applied on surfaces to be...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DERKACH G.G, KLJAZHNIKOV G.I, SAGALOVICH V.V, SEMENOV V.N, OVSJANKIN V.P
Format: Patent
Sprache:eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:FIELD: power machine engineering, namely soldering thick wall telescopic structures. SUBSTANCE: structure includes outer 1 and inner 2 envelopes with thin-wall compensating member 3 having end in hard-to-reach zone. Outer envelope has turning 5 and groove 6. Nickel coat is applied on surfaces to be soldered. Layer of homogeneous nickel base alloy is fused on welded places. Inner envelope is arranged inside outer one in such a way that extension of compensating member 3 enters turning 5 with gap. Sealed cavities 4,7 are formed at assembling. Cavities are evacuated and wall of compensating member is drawn into groove 6. Then at temperature less than soldering temperature by 15-25 C isothermal holding is realized in furnace with argon atmosphere at 1015 C for 15 minutes. At cooling process steps of isothermal holding for 20 minutes at 650 C, cooling and removal of compensating member are performed. EFFECT: enhanced quality of soldered joints due to their high-degree fluid-tightness. 1 dwgl