ADHESIVE

ADHESIVE

FIELD: adhesion and sealing of compounds. SUBSTANCE: adhesive comprises epoxy diane resin, polyethylene polyamine being modified by 1,2-di(oxymethyl)-ortho-carborane, oligoamide and carbonyl ferrum. EFFECT: increased thermal and mechanical resistance. 2 tbl;

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: AKIMOV B.A, SHEBASHOVA N.M, PREOBRAZHENSKIJ I.M, MAL'TSEVA G.K, KULIKOV G.A, NIKITINA N.L, SHEBASHOV JU.N, CHESNOKOVA I.V
Format: Patent
Sprache:eng ; rus
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:FIELD: adhesion and sealing of compounds. SUBSTANCE: adhesive comprises epoxy diane resin, polyethylene polyamine being modified by 1,2-di(oxymethyl)-ortho-carborane, oligoamide and carbonyl ferrum. EFFECT: increased thermal and mechanical resistance. 2 tbl;