METHOD OF CHEMICAL POLISHING OF ALUMINUM

METHOD OF CHEMICAL POLISHING OF ALUMINUM

FIELD: chemical polishing processes. SUBSTANCE: invention relates to chemical polishing of aluminum consisting in treating it by polishing solution, washing, and nitric acid treatment. Samples are preliminarily etched in 50% sulfuric acid, washed with water, clarified by 30% nitric acid, washed by w...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHUMAEVSKIJ V.A, MJAKISHEVA E.A
Format: Patent
Sprache:eng
Schlagworte:
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
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Beschreibung
Zusammenfassung:FIELD: chemical polishing processes. SUBSTANCE: invention relates to chemical polishing of aluminum consisting in treating it by polishing solution, washing, and nitric acid treatment. Samples are preliminarily etched in 50% sulfuric acid, washed with water, clarified by 30% nitric acid, washed by water, and polished for 1-2 min at 80-90 C in solution composed, wt. -%: extraction phosphoric acid, 28.0-28.5; orthophosphoric acid, 28.5-30.0; nitric acid, 3-7; sulfuric acid, 11-16; copper (on conversion to cupric ion), 0.07-0.14; water, the balance. Copper is introduced in the form of sulfate and nitrate. Polished samples are washed out by hot water and treated with 20-30% nitric acid solution to remove passive film and traces of released copper metal. If necessary, polished objects are subjected to anodization. EFFECT: enhanced efficiency of process.