PROCESS OF WET CHEMICAL TREATMENT OF DISC PREFORMS

The invention relates to a process for wet chemical treatment of objects, especially semiconductor wafers, by causing a treatment medium to which gas has been applied to flow onto the object, the treatment medium being generated by homogeneously dispersing gas bubbles in a liquid.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	GYUNTER SHVAB, PETER ROMEDER, MAKS SHTADLER
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CLEANING CLEANING IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to a process for wet chemical treatment of objects, especially semiconductor wafers, by causing a treatment medium to which gas has been applied to flow onto the object, the treatment medium being generated by homogeneously dispersing gas bubbles in a liquid.