METHOD FOR PRODUCING ELECTROLYTIC COPPER FOIL

The present invention relates to a method for producing an electrolytic copper foil, the method enabling providing an electrolytic copper foil such that the electrical conductivity is 99% or more, the thickness is 10 µm or less, a problem of a bend is suppressed, the front side and the rear side are...

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1. Verfasser: OGURO, RYOICHI
Format: Patent
Sprache:eng ; srp
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Beschreibung
Zusammenfassung:The present invention relates to a method for producing an electrolytic copper foil, the method enabling providing an electrolytic copper foil such that the electrical conductivity is 99% or more, the thickness is 10 µm or less, a problem of a bend is suppressed, the front side and the rear side are flat, the tensile strength is 500 MPa or more, and the elongation percentage is 5.5% or more. The method for producing an electrolytic copper foil includes forming an electrolytic copper foil by using, as an electrolytic solution, a sulfuric acid-copper sulfate aqueous solution not containing a heavy metal other than a copper metal, using an insoluble anode and a cathode drum facing the insoluble anode, and passing a direct current between these electrodes, wherein, in the electrolytic solution, particular additives (A) to (E) are contained each in a particular amount, and the additive (D) and the additive (A) are each added in a ratio such that (D)/(A) is 0.2 to 0.7.