PROCESS FOR ASSEMBLING SEMICONDUCTOR DEVICES AND INSTALLATION FOR CARRYING OUT SAID PROCESS

Inventia se refera la un procedeu pentru asamblarea unor dispozitive semiconductoare si la o instalatie pentru aplicarea acesteia. procedeul, conform inventiei, consta din realizarea unei punti de legatura, din sârma între punctele de conexiune de pe carcasa si chipul unui dispozitiv semiconductor....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZINOVY MIKHALEVICH SLAVINSKY, ALEXANDR ANATOLEVICH GULYAEV, VITALY GEORGIEVICH MELNIK, VALERY ALEXANDROVICH KALACHEV, VYACHESLAV GENNADIEVICH SIZOV
Format:	Patent
Sprache:	eng ; rum
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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