CU-CORED SOLDER BALL

To provide a Cu core ball that prevents any soft errors and decreases any connection failure. A solder plating film formed on a surface of a Cu ball is an Sn solder plating film or is made of lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U content of...

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Bibliographische Detailangaben
Hauptverfasser:	ISAMU SATO, HIROYOSHI KAWASAKI, ATSUSHI IKEDA, TOMOHIKO HASHIMOTO, YUJI KAWAMATA, TAKAHIRO ROPPONGI, DAISUKE SOMA
Format:	Patent
Sprache:	eng ; por
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	To provide a Cu core ball that prevents any soft errors and decreases any connection failure. A solder plating film formed on a surface of a Cu ball is an Sn solder plating film or is made of lead-free solder alloy, a principal ingredient of which is Sn. The solder plating film contains U content of 5 ppb or less and Th content of 5 ppb or less. The Cu ball includes purity of not less than 99.9 % through not more than 99.995%. Pb and/or Bi contents therein are a total of 1 ppm or more. A sphericity thereof is 0.95 or more. The obtained Cu core ball has ± dose of 0.0200 cph/cm 2 or less.