METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON SUBSTRATES
Described is a method of forming a metal or metal alloy layer onto a substrate comprising the following steps i) provide a substrate including a permanent resin layer on top of at least one contact area and a temporary resin layer on top of the permanent resin layer, ii) contact the entire substrate...
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| creator | SVEN LAMPRECHT KAI-JENS MATEJAT CATHERINE SCHOENENBERGER JÜRGEN KRESS INGO EWERT |
| description | Described is a method of forming a metal or metal alloy layer onto a substrate comprising the following steps i) provide a substrate including a permanent resin layer on top of at least one contact area and a temporary resin layer on top of the permanent resin layer, ii) contact the entire substrate area including the at least one contact area with a solution suitable to provide a conductive layer on the substrate surface and i) electroplate a metal or metal alloy layer onto the conductive layer. |
| format | Patent |
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| language | eng ; por |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON SUBSTRATES |
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